Optical wafer defect inspection at the 10 nm technology node and beyond

Abstract The growing demand for electronic devices, smart and the Internet of Things constitutes primary driving force marching down path decreased critical dimension increased circuit intricacy integrated circuits. However, as sub-10 nm high-volume manufacturing is becoming mainstream, there greater awareness that defects introduced by original equipment manufacturer components impact yield costs. identification, positioning, classification these defects, including random particles systematic are more challenging at 10 node beyond. Very recently, combination conventional optical defect inspection with emerging techniques such nanophotonics, vortices, computational imaging, quantitative phase deep learning giving field a new possibility. Hence, it extremely necessary to make thorough review disclosing perspectives exciting trends, on foundation former great reviews in methods. In this article, we give comprehensive topics past decade focus three specific areas: (a) detectability evaluation, (b) diverse systems, (c) post-processing algorithms. We hope, work can be importance both entrants people who seeking use interdisciplinary work.